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From silicon to silicon wafer process flow and equipment, all wafer machines and diamond wire cutting
Publish：2018-04-09 View：412
Diamond wire cutting is the main method of silicon wafer cutting, mainly using electroplated diamond wire. Electroplated diamond wire is a linear sawing tool made by adding a certain amount of diamond abrasive to the plating solution. When the metal ions in the plating solution are reduced to metal in the cathode and deposited on the wire saw substrate, diamond particles are encapsulated into the coating. The production process includes pre-treatment, pre plating, sanding, thickening, and subsequent processing. Pre treatment includes polishing the substrate before plating, alkaline washing to remove oil, and acid washing activation; Pre plating is to deposit a transition layer between the substrate and diamond; The subsequent sanding process electroplating diamond onto the substrate; The thickening process increases the adhesion of nickel coating to diamond abrasive.

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